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Review Solder Joint Reliability of BGA CSP Flip Chip and Fine Pitch SMT Assemblies by John H Lau Yi Hsin Pao

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Solder Joint Reliability of BGA, CSP, Flip Chip, and Fine Pitch SMT Assemblies by John H. Lau,Yi-Hsin Pao EPUB KINDLE PDF EBOOK. Size: 35,230 KB. Solder Joint Reliability of BGA, CSP, Flip Chip, and Fine Pitch SMT Assemblies John H. Lau,Yi-Hsin Pao pdf.

[ BOOK SOLDER JOINT RELIABILITY OF BGA, CSP, FLIP CHIP, AND FINE PITCH SMT ASSEMBLIES by JOHN H. LAU,YI-HSIN PAO OVERVIEW ]

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This new volume by interconnection expert on solder joints, Johns H. Lau, deals with BGA, CSP, Flip Chips, and other new technologies that underlie the electronics industry's need for smaller, faster products. Naturally, as ever-smaller products are created, the reliability of the solder joints that bind them becomes increasingly crucial. Balancing concepts and practical applications, the authors explain the fundamentals of solder joint reliability and present creative, robust packaging techniques for cost-effective interconnection.