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The ultimate, up-to-the-minute electronic packaging resource

The ever-increasing pin counts and clock speeds of modern electronics continue to "push the performance envelope" with regard to designing packaging and interconnection solutions that can meet increasingly challenging requirements. Here's the help you need!

For the first time, four well-known experts representing the four relevant fields--mechanical engineering, electrical engineering, thermal management, and materials--team up to provide a single-volume comprehensive reference that explains packaging and interconnection basics, details d

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Book ID Asin: 0070371350
Book Title: Electronic Packaging: Design, Materials, Process, and Reliability
Book Author: John H. Lau,C.P. Wong,J.L. Prince
Book Format and Price:
Book Format Name: Hardcover
Book Format Price: $3.63
Book Price: unknown
Book Category: Books, Engineering & Transportation, Engineering and unknown
Book Rating: 2 ratings

Book Review: unknown